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	<id>https://hades.mech.northwestern.edu//index.php?action=history&amp;feed=atom&amp;title=Integrated_Circuits</id>
	<title>Integrated Circuits - Revision history</title>
	<link rel="self" type="application/atom+xml" href="https://hades.mech.northwestern.edu//index.php?action=history&amp;feed=atom&amp;title=Integrated_Circuits"/>
	<link rel="alternate" type="text/html" href="https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;action=history"/>
	<updated>2026-05-19T10:22:43Z</updated>
	<subtitle>Revision history for this page on the wiki</subtitle>
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	<entry>
		<id>https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=4288&amp;oldid=prev</id>
		<title>Hwang at 23:23, 1 November 2006</title>
		<link rel="alternate" type="text/html" href="https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=4288&amp;oldid=prev"/>
		<updated>2006-11-01T23:23:33Z</updated>

		<summary type="html">&lt;p&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 18:23, 1 November 2006&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 1:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 1:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;It is possible to cram dozens to millions of transistors and passive elements onto a single slab of silicon. This is known as an &#039;&#039;&#039;integrated circuit&#039;&#039;&#039;, or &#039;&#039;&#039;IC&#039;&#039;&#039;.&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;It is possible to cram dozens to millions of transistors and passive elements onto a single slab of silicon. This is known as an &#039;&#039;&#039;integrated circuit&#039;&#039;&#039;, or &#039;&#039;&#039;IC&#039;&#039;&#039;.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_package.jpg|right|thumb|A DIP-14]]  Integrated circuits come in different &#039;&#039;&#039;packages&#039;&#039;&#039;.  The package refers to the type of exterior casing that the connects the actual integrated circuit chip to its input and output pins.  A common type of package is the &#039;&#039;Dual-In-Line Package&#039;&#039;, or DIP.  This package contains a rectangular box with two rows of pins coming out of the long edge.  The number &lt;del style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;the&lt;/del&gt; succeeds &quot;DIP&quot; denotes the number of pins in package.  The package often has an indentation or dot at one end to help identify the pins.&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_package.jpg|right|thumb|A DIP-14]]  Integrated circuits come in different &#039;&#039;&#039;packages&#039;&#039;&#039;.  The package refers to the type of exterior casing that the connects the actual integrated circuit chip to its input and output pins.  A common type of package is the &#039;&#039;Dual-In-Line Package&#039;&#039;, or DIP.  This package contains a rectangular box with two rows of pins coming out of the long edge.  The number &lt;ins style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;that&lt;/ins&gt; succeeds &quot;DIP&quot; denotes the number of pins in package.  The package often has an indentation or dot at one end to help identify the pins.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&amp;lt;br clear=&quot;all&quot;&amp;gt;&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&amp;lt;br clear=&quot;all&quot;&amp;gt;&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Hwang</name></author>
	</entry>
	<entry>
		<id>https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3346&amp;oldid=prev</id>
		<title>Hwang at 21:19, 12 July 2006</title>
		<link rel="alternate" type="text/html" href="https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3346&amp;oldid=prev"/>
		<updated>2006-07-12T21:19:56Z</updated>

		<summary type="html">&lt;p&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 16:19, 12 July 2006&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 6:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 6:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;Since integrated circuits are sensitive to heat, a socket is often first soldered to the board, and the IC package then plugged into the sockets.  Sockets are also useful if the chip might need to be swapped.&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;Since integrated circuits are sensitive to heat, a socket is often first soldered to the board, and the IC package then plugged into the sockets.  Sockets are also useful if the chip might need to be swapped.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_socket.jpg|thumb|A DIP socket]]&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_socket.jpg|thumb&lt;ins style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;|left&lt;/ins&gt;|A DIP socket]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Hwang</name></author>
	</entry>
	<entry>
		<id>https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3345&amp;oldid=prev</id>
		<title>Hwang at 21:19, 12 July 2006</title>
		<link rel="alternate" type="text/html" href="https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3345&amp;oldid=prev"/>
		<updated>2006-07-12T21:19:21Z</updated>

		<summary type="html">&lt;p&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 16:19, 12 July 2006&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 4:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 4:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&amp;lt;br clear=&quot;all&quot;&amp;gt;&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&amp;lt;br clear=&quot;all&quot;&amp;gt;&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&lt;del style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;[[Image:DIP_socket.jpg|right|thumb|A DIP socket]]&lt;/del&gt;Since integrated circuits are sensitive to heat, a socket is often first soldered to the board, and the IC package then plugged into the sockets.  Sockets are also useful if the chip might need to be swapped.&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;Since integrated circuits are sensitive to heat, a socket is often first soldered to the board, and the IC package then plugged into the sockets.  Sockets are also useful if the chip might need to be swapped.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-empty diff-side-deleted&quot;&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-empty diff-side-deleted&quot;&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_socket.jpg|thumb|A DIP socket]]&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Hwang</name></author>
	</entry>
	<entry>
		<id>https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3344&amp;oldid=prev</id>
		<title>Hwang at 21:18, 12 July 2006</title>
		<link rel="alternate" type="text/html" href="https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3344&amp;oldid=prev"/>
		<updated>2006-07-12T21:18:51Z</updated>

		<summary type="html">&lt;p&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
				&lt;tr class=&quot;diff-title&quot; lang=&quot;en&quot;&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 16:18, 12 July 2006&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 1:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 1:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-empty diff-side-deleted&quot;&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;It is possible to cram dozens to millions of transistors and passive elements onto a single slab of silicon. This is known as an &#039;&#039;&#039;integrated circuit&#039;&#039;&#039;, or &#039;&#039;&#039;IC&#039;&#039;&#039;.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-empty diff-side-deleted&quot;&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_package.jpg|right|thumb|A DIP-14]]  Integrated circuits come in different &#039;&#039;&#039;packages&#039;&#039;&#039;.  The package refers to the type of exterior casing that the connects the actual integrated circuit chip to its input and output pins.  A common type of package is the &#039;&#039;Dual-In-Line Package&#039;&#039;, or DIP.  This package contains a rectangular box with two rows of pins coming out of the long edge.  The number the succeeds &quot;DIP&quot; denotes the number of pins in package.  The package often has an indentation or dot at one end to help identify the pins.&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_package.jpg|right|thumb|A DIP-14]]  Integrated circuits come in different &#039;&#039;&#039;packages&#039;&#039;&#039;.  The package refers to the type of exterior casing that the connects the actual integrated circuit chip to its input and output pins.  A common type of package is the &#039;&#039;Dual-In-Line Package&#039;&#039;, or DIP.  This package contains a rectangular box with two rows of pins coming out of the long edge.  The number the succeeds &quot;DIP&quot; denotes the number of pins in package.  The package often has an indentation or dot at one end to help identify the pins.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&amp;lt;br clear=&quot;all&quot;&amp;gt;&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&amp;lt;br clear=&quot;all&quot;&amp;gt;&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Hwang</name></author>
	</entry>
	<entry>
		<id>https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3339&amp;oldid=prev</id>
		<title>Hwang at 21:07, 12 July 2006</title>
		<link rel="alternate" type="text/html" href="https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3339&amp;oldid=prev"/>
		<updated>2006-07-12T21:07:37Z</updated>

		<summary type="html">&lt;p&gt;&lt;/p&gt;
&lt;table style=&quot;background-color: #fff; color: #202122;&quot; data-mw=&quot;interface&quot;&gt;
				&lt;col class=&quot;diff-marker&quot; /&gt;
				&lt;col class=&quot;diff-content&quot; /&gt;
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				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;← Older revision&lt;/td&gt;
				&lt;td colspan=&quot;2&quot; style=&quot;background-color: #fff; color: #202122; text-align: center;&quot;&gt;Revision as of 16:07, 12 July 2006&lt;/td&gt;
				&lt;/tr&gt;&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 1:&lt;/td&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-lineno&quot;&gt;Line 1:&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;−&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #ffe49c; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_package.jpg|right|thumb|A DIP-14]]  Integrated circuits come in different &#039;&#039;&#039;packages&#039;&#039;&#039;.  The package refers to the type of exterior casing that the connects the actual integrated circuit chip to its input and output pins.  A common type of package is the &#039;&#039;Dual-In-Line Package&#039;&#039;, or DIP.  This package contains a rectangular box with two rows of pins coming out of the long edge.  The number the succeeds &quot;DIP&quot; denotes the number of pins in package.  The package&lt;del style=&quot;font-weight: bold; text-decoration: none;&quot;&gt; will&lt;/del&gt; often &lt;del style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;have&lt;/del&gt; an indentation or dot at one end to help identify the pins.&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_package.jpg|right|thumb|A DIP-14]]  Integrated circuits come in different &#039;&#039;&#039;packages&#039;&#039;&#039;.  The package refers to the type of exterior casing that the connects the actual integrated circuit chip to its input and output pins.  A common type of package is the &#039;&#039;Dual-In-Line Package&#039;&#039;, or DIP.  This package contains a rectangular box with two rows of pins coming out of the long edge.  The number the succeeds &quot;DIP&quot; denotes the number of pins in package.  The package often &lt;ins style=&quot;font-weight: bold; text-decoration: none;&quot;&gt;has&lt;/ins&gt; an indentation or dot at one end to help identify the pins.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&amp;lt;br clear=&quot;all&quot;&amp;gt;&lt;/div&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;&amp;lt;br clear=&quot;all&quot;&amp;gt;&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-empty diff-side-deleted&quot;&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;br /&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;tr&gt;
  &lt;td colspan=&quot;2&quot; class=&quot;diff-empty diff-side-deleted&quot;&gt;&lt;/td&gt;
  &lt;td class=&quot;diff-marker&quot; data-marker=&quot;+&quot;&gt;&lt;/td&gt;
  &lt;td style=&quot;color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;&quot;&gt;&lt;div&gt;[[Image:DIP_socket.jpg|right|thumb|A DIP socket]]Since integrated circuits are sensitive to heat, a socket is often first soldered to the board, and the IC package then plugged into the sockets.  Sockets are also useful if the chip might need to be swapped.&lt;/div&gt;&lt;/td&gt;
&lt;/tr&gt;
&lt;/table&gt;</summary>
		<author><name>Hwang</name></author>
	</entry>
	<entry>
		<id>https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3337&amp;oldid=prev</id>
		<title>Hwang at 20:12, 12 July 2006</title>
		<link rel="alternate" type="text/html" href="https://hades.mech.northwestern.edu//index.php?title=Integrated_Circuits&amp;diff=3337&amp;oldid=prev"/>
		<updated>2006-07-12T20:12:33Z</updated>

		<summary type="html">&lt;p&gt;&lt;/p&gt;
&lt;p&gt;&lt;b&gt;New page&lt;/b&gt;&lt;/p&gt;&lt;div&gt;[[Image:DIP_package.jpg|right|thumb|A DIP-14]]  Integrated circuits come in different &amp;#039;&amp;#039;&amp;#039;packages&amp;#039;&amp;#039;&amp;#039;.  The package refers to the type of exterior casing that the connects the actual integrated circuit chip to its input and output pins.  A common type of package is the &amp;#039;&amp;#039;Dual-In-Line Package&amp;#039;&amp;#039;, or DIP.  This package contains a rectangular box with two rows of pins coming out of the long edge.  The number the succeeds &amp;quot;DIP&amp;quot; denotes the number of pins in package.  The package will often have an indentation or dot at one end to help identify the pins.&lt;br /&gt;
&amp;lt;br clear=&amp;quot;all&amp;quot;&amp;gt;&lt;/div&gt;</summary>
		<author><name>Hwang</name></author>
	</entry>
</feed>